Services

CORE TECHNOLOGIES

TECHNICAL CAPABILITIES

Comprehensive technical specifications and capabilities of our core SiC processing technologies

01
High-temperature electric furnace smelting technology

High-temperature electric furnace smelting technology

Advanced high-temperature electric furnace systems operating at temperatures exceeding 2,500°C. Our proprietary smelting process ensures optimal crystal formation and minimal impurity incorporation. Precision temperature control systems maintain thermal stability within ±5°C, enabling consistent material quality across production batches.

Key Features & Specifications

  • Temperature range: 2,200°C - 2,800°C
  • Real-time thermal monitoring and control
  • Energy-efficient heating elements
  • Automated atmosphere control systems
02
Crystal crushing control process

Crystal crushing control process

Specialized mechanical crushing technology designed to preserve crystal structure integrity while achieving desired particle size distributions. Our multi-stage crushing process minimizes crystal lattice damage and ensures uniform particle morphology, critical for downstream applications.

Key Features & Specifications

  • Multi-stage crushing optimization
  • Minimal crystal structure damage
  • Consistent particle morphology
  • Contamination-free processing environment
03
Precise screening and particle size control

Precise screening and particle size control

State-of-the-art screening technology utilizing advanced vibration systems and precision mesh configurations. We achieve tight particle size distributions with D50 tolerances of ±2μm, ensuring material consistency for demanding applications in semiconductors and advanced ceramics.

Key Features & Specifications

  • Precision mesh systems: 10μm - 500μm
  • Automated particle size analysis
  • Real-time distribution monitoring
  • ISO-certified quality standards
04
Strict chemical composition testing

Strict chemical composition testing

Comprehensive analytical testing using ICP-MS, XRF, and LECO analysis systems to verify chemical purity and detect trace impurities down to ppb levels. Every production batch undergoes rigorous testing to ensure compliance with international semiconductor-grade specifications.

Key Features & Specifications

  • ICP-MS for trace element analysis
  • Carbon and oxygen content measurement
  • Heavy metal detection (< 1 ppm)
  • Full COA documentation for each batch
05
Multi-dimensional morphology and purity monitoring

Multi-dimensional morphology and purity monitoring

Advanced characterization using SEM, TEM, and laser diffraction systems to analyze particle morphology, crystal structure, and purity. Our multi-dimensional analysis ensures material performance consistency and identifies potential quality issues before shipment.

Key Features & Specifications

  • SEM/TEM morphology analysis
  • XRD crystal structure verification
  • Laser particle size distribution
  • Surface area and porosity testing
06
Complete production batch management system

Complete production batch management system

Fully integrated digital traceability system tracking every production parameter from raw material reception to final product shipment. Our ERP-based system ensures complete batch-to-batch consistency and enables rapid quality issue resolution with full material genealogy.

Key Features & Specifications

  • End-to-end digital traceability
  • Real-time production monitoring
  • Automated quality documentation
  • Compliance with ISO 9001 and IATF 16949
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