Services

CORE TECHNOLOGIES

TECHNICAL CAPABILITIES IN DETAIL

Comprehensive technical specifications and capabilities of our core SiC processing technologies

High-temperature electric furnace smelting technology

Advanced high-temperature electric furnace systems operating at temperatures exceeding 2,500°C. Our proprietary smelting process ensures optimal crystal formation and minimal impurity incorporation. Precision temperature control systems maintain thermal stability within ±5°C, enabling consistent material quality across production batches.

Key Features & Specifications

  • Temperature range: 2,200°C - 2,800°C
  • Real-time thermal monitoring and control
  • Energy-efficient heating elements
  • Automated atmosphere control systems
01

Crystal crushing control process

Specialized mechanical crushing technology designed to preserve crystal structure integrity while achieving desired particle size distributions. Our multi-stage crushing process minimizes crystal lattice damage and ensures uniform particle morphology, critical for downstream applications.

Key Features & Specifications

  • Multi-stage crushing optimization
  • Minimal crystal structure damage
  • Consistent particle morphology
  • Contamination-free processing environment
02

Precise screening and particle size control

State-of-the-art screening technology utilizing advanced vibration systems and precision mesh configurations. We achieve tight particle size distributions with D50 tolerances of ±2μm, ensuring material consistency for demanding applications in semiconductors and advanced ceramics.

Key Features & Specifications

  • Precision mesh systems: 10μm - 500μm
  • Automated particle size analysis
  • Real-time distribution monitoring
  • ISO-certified quality standards
03

Strict chemical composition testing

Comprehensive analytical testing using ICP-MS, XRF, and LECO analysis systems to verify chemical purity and detect trace impurities down to ppb levels. Every production batch undergoes rigorous testing to ensure compliance with international semiconductor-grade specifications.

Key Features & Specifications

  • ICP-MS for trace element analysis
  • Carbon and oxygen content measurement
  • Heavy metal detection (< 1 ppm)
  • Full COA documentation for each batch
04

Multi-dimensional morphology and purity monitoring

Advanced characterization using SEM, TEM, and laser diffraction systems to analyze particle morphology, crystal structure, and purity. Our multi-dimensional analysis ensures material performance consistency and identifies potential quality issues before shipment.

Key Features & Specifications

  • SEM/TEM morphology analysis
  • XRD crystal structure verification
  • Laser particle size distribution
  • Surface area and porosity testing
05

Complete production batch management system

Fully integrated digital traceability system tracking every production parameter from raw material reception to final product shipment. Our ERP-based system ensures complete batch-to-batch consistency and enables rapid quality issue resolution with full material genealogy.

Key Features & Specifications

  • End-to-end digital traceability
  • Real-time production monitoring
  • Automated quality documentation
  • Compliance with ISO 9001 and IATF 16949
06
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